Emerson’s compact, rugged PC connects industrial floor to cloud
PacSystems PC 2010 Compact Industrial PC (IPC) Emerson’s rugged industrial computer is designed as a pre-packaged and economical solution to allow users to set up edge-enabled applications. It can handle a wide range of machine and discrete part manufacturing automation applications. Manufacturers can use it and its associated software to establish operational technology/information technology (OT/IT) interconnectivity and Industrial Internet-of-Things functionality right from the plant. The technology also allows end users to build these capabilities on top of their existing equipment and manufacturing operations. Emerson says it already is building the IPC 2010 into a range of larger offerings for leak detection, compressed air monitoring, batching systems, cloud enablement services and other packaged solutions.
What’s new? The IPC.
Benefits A ruggedized design, along with powerful computing abilities that suit the plant floor. The energy-efficient IPC is cost-effective and has a wide operating temperature. With it, users can run applications quickly. Emerson has made provisions for keeping the software current and passively maintained, minimizing user effort while maximizing reliability. Both the hardware and software are designed to be easy to use, adaptable, universal and scalable.
Emerson Electric Co., St. Louis, Mo., 314-553-2000, www.emerson.com
Karen Hanna | Senior Staff Reporter
Senior Staff Reporter Karen Hanna covers injection molding, molds and tooling, processors, workforce and other topics, and writes features including In Other Words and Problem Solved for Plastics Machinery & Manufacturing, Plastics Recycling and The Journal of Blow Molding. She has more than 15 years of experience in daily and magazine journalism.
