Dyna-Purge E4 tailored for engineering resins
E4 Shuman Plastics’ Dyna-Purge division developed this purging compound for use by manufacturers that work with high-temperature engineering resins. It features dual-action purging attributes for improved scrubbing action coupled with a thermally stable carrier matrix. It’s appropriate for extruders and both hot runners and cold runners, and for use with daily color changes, preventive maintenance prior to cleaning and sealing during shutdown and startup phases. Trial samples are available upon request.
What's new? The compound, which Shuman exhibited at the K show.
Benefits Safe, easy and cost-efficient removal of resins, colorants, carbon, additives and impurities. The compound is effective in small doses, without blending with other resins or lost time due to soaking activation. It withstands degradation at higher temperatures and reduces smoke emissions and oxidization during shutdown and startup phases.
Dyna-Purge Division of Shuman Plastics Inc., Depew, N.Y., 716-685-2121, www.dynapurge.com
Vital Statistics
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Applications |
Injection molding — cold and hot runners; and extrusion — profile, sheet, cast film and compounding |
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Temperature range |
575 degrees Fahrenheit to 715 degrees Fahrenheit |
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Types of resins |
High-temperature engineering resins, including polyether ether ketone (PEEK), polyetherimide (PEI), polyphenylene sulfide (PPS) polyphthalamide (PPA) and polysulfone (PSU) |
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Minimum clearance |
0.75 mm |
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Amount of purge |
One to two times barrel capacity (actual amount depends upon machine conditions) |